The new chip also introduces further refinements in Intel's established SpeedStep technology, which dynamically reduces processor speed and voltage as the situation allows. The Pentium-M's more compartmentalised processor allows finer control over shutting down the parts that aren't needed and reduces the voltage before the frequency slowly enough for the CPU to be able to continue what it's doing whilst this is happening.
Designed in tandem with the Pentium-M processor, the Intel 855 chipset has a lower core voltage in comparison to previous generations of memory controller hubs and utilises innovative design features to reduce memory interface power during system idle conditions. Design enhancements such as increased burst length size, timing improvements and shorter refresh cycles also contribute to improved performance.
The 855 chipset's features include:
a 400MHz (100MHz x four) system bus offers a peak bandwidth of 3.2GBps
DDR memory channels offering a peak bandwidth of 2.1GBps, and
an AGP 4x interface allowing graphics controllers access to main memory at over 1GBps.
and the new ICH4-M Southbridge offers standard support for:
Ultra ATA/100
10/100BaseTX Ethernet
AC97 audio
PC Card
Modem
USB 2.
The chipset comes in two forms, the 855PM and the 855GM, the latter including integrated graphics.
The third and final Centrino component is the Intel PRO/Wireless adapter. When details of Banias were first revealed in 2002, the expectation was for the wireless networking support to be hardwired into the motherboard as part of the chipset. In fact, Wi-Fi has been implemented as a mini-PCI card and slot. This is a more sensible arrangement, since it allows more scope for upgrades of a rapidly developing technology.
Indeed, it was not long before the benefit of the revised strategy were seen. With the work on wireless standards progressing more quickly than had been expected, Intel revised its plans for upgrading Centrino's original 802.11b part to accommodate other wireless standards. By mid-2003, the schedule was to have introduced a dual-band 802.11b/802.11a adapter by the third quarter and to have bundled support for 802.11g by the end of the year.
Also scheduled for the end of the year is for the Centrino processor manufacturing process to move from 0.13-micron to 0.09-micron. With the chip available in both FCPGA and FCBGA packages, these low voltage CPUs offer the prospect of high-powered, wireless-networked, ultra-portable notebooks in the not too distant future.
ـ[عنزي]ــــــــ[24 - 02 - 2009, 06:02 ص]ـ
عبد ذي الجلال والإكرام:
ما علاقة هذا الوصف, و يصب لخدمة تجارة و إعلان, بأصول العربية؟ هناك من كان معاشه لزبائن ذي احتياجاتك: أي, هنا موقع لخدمة العربية و ليس بدار ترجمة.